At the 2026 IEEE International Symposium on Circuits and Systems (ISCAS) in Shanghai on Monday, during a keynote speech titled "Exploration and Practice of New Paths for Semiconductors," Huawei board member and semiconductor business president HE Tingbo formally introduced what she called the “Tau Law.”
According to Huawei, this is the first time a Chinese company has proposed a new principle intended to guide semiconductor industry development globally. HE said Huawei has designed and mass-produced 381 chips over the past six years based on the principle.
She also said Huawei plans to launch a new Kirin smartphone chip this autumn using what the company described as "logic folding" technology, which would significantly improve performance.
