By PENG Xin
TSMC, one of the world's leading semiconductor foundries, generated consolidated revenue of TW$547 billion (120 billion yuan, US$17 billion) and a net income of TW$210 billion in Q3, both figures down on last year, but a slight improvement on Q2.
Digging deeper into the report, 3-nanometer technology contributed 6 percent of wafer revenue, 5-nanometer tech 37 percent, and 7-nanometer 16 percent.
Strong demand for the 3-nanometer technology is expected to provide stable support for the company's revenue, with AI poised to be another significant driver of growth.
TSMC intends to double packing capacity, known as CoWoS (Chip on Wafer on Substrate), by the end of 2024. Beyond the 3-nanometer tech, TSMC will begin manufacturing of 2-nanometer technology in 2025.
The market remains clouded by uncertainties, including new restrictions on chip exports imposed by the US that could affect the flow of products into the Chinese mainland.
